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Parker Chomerics invented a system that protects drones from interference

1 min read
Parker Chomerics invented a system that protects drones from interference

Parker Chomerics, based in Massachusetts, has invented a system of protecting drones against electromagnetic interference and overheating. Drones flying near cellular towers, buildings, antennas, high-voltage power lines, and other barriers may experience severe electromagnetic interference (EMI), risking their performance and safety.

Another big concern is overheating, which is caused by the drone’s electronics and rotors being subjected to a high processing load.

To keep inside electronics from malfunctioning, proper shielding is required to meet the EMI problems. A method of preventing overheating is also required so that the drone can function properly.

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Drones must be mass-produced in order to be economically successful, therefore any shielding should allow for automated assembly to keep prices down. Drones must also be light in weight and allow for reliable connections between the drone and the controller. And weather resistance is an important feature.

Parker Chomerics Choform 5575 form-in-place (FIP) EMI gasket is a robotically dispensed material that can be directly applied to the aluminum casting of the drone to act as a barrier, preventing the electrical circuits from talking to each other and causing premature failure, to meet these requirements.

Choform 5575 is a silver-plated aluminum-filled silicone material that is moisture cured and can block up to 80 decibels.

Because flanges can be as small as 0.76mm, using a FIP gasket can save up to 60% of space and weight in the drone housing. When applied to metal, it has strong corrosion resistance, preventing galvanic corrosion in the electronic enclosure.

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Parker Chomerics developed Therm-A-Gap Gel 37, which has a thermal conductivity of 3.7W/m-K to help reduce thermal impacts. The heat is transferred from the chipset to the drone’s enclosure via this wire.

Automation can pour this pre-cured, single-component thermal gel material directly onto the chipset, cutting production time. It has a smooth, paste-like consistency that prevents electrical components from being stressed, and it doesn’t require any mixing or curing.

Using automated methods to apply EMI shielding and a thermal gel to the drone can boost productivity and shorten the time to market.

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